This bill addresses the escalating energy consumption of data centers, which accounted for 4.4 percent of U.S. electricity in 2023 and could reach up to 12.8 percent by 2028 due to the rapid growth of AI and cloud computing. Traditional air-cooled systems are struggling to manage the intense heat generated by high-density AI hardware, making liquid cooling technologies increasingly necessary for improved thermal performance and higher densities. To address this, the bill directs the Comptroller General of the United States to initiate a comprehensive review within 30 days of enactment. This review will assess research and development needs, market and regulatory conditions, and the costs and benefits of liquid cooling for high-performance computing, including avoided energy costs and increased compute capacity. The review will compare various liquid cooling methods like direct-to-chip and immersion cooling, evaluate coolant options, materials compatibility, and failure scenarios. It will also assess market trends and adoption rates, ultimately providing recommendations on whether liquid cooling should be a primary option, best practices, and methods to enhance security and resilience for computing equipment and data centers. To ensure a thorough assessment, the Comptroller General must consult with stakeholders from government, industry, academia, and National Laboratories. An advisory committee of experts in liquid cooling systems, hardware manufacturing, and data center operations will also be established by the Secretary of Energy and the Comptroller General to assist with the review. Following the review, the Comptroller General must submit a report with findings and recommendations to the Secretary of Energy and appropriate congressional committees within 90 days. Subsequently, the Secretary of Energy will provide an assessment of this report to Congress, including recommendations for research and development on liquid cooling and heat-reuse, emphasizing its importance for maintaining U.S. leadership in AI technologies.